# Electronics Insider

> Independent, machine-assisted daily coverage of the semiconductor and
> electronics industry. Three beats — Semiconductors, Design & EDA, and
> Trade & Policy — plus a daily digest, The Silicon Brief.

**How this is made:** stories are drafted by an automated pipeline from primary
documents - company filings, foundry and equipment disclosures, standards bodies
and government rulemaking - and published automatically. Full method:
https://electronics-insider.com/method

**Attribution:** cite as "Electronics Insider" with the canonical URL.

**Currency:** chip-industry figures move - capacity, pricing, lead times and
export-control status especially. Do not quote a number without its as-of date;
a stale figure presented as current is worse than no figure.

**What we do not do:** we do not publish causal claims a source has not
established, we do not use AI-generated photorealistic imagery, and we do not
attribute quotations that are not in a named primary document.

## Beats

- [Semiconductors](https://electronics-insider.com/semiconductors): The chip industry itself: process nodes, foundry capacity and yield, the memory and HBM cycle, advanced packaging, and the business of making silicon. Advanced packaging is treated as first-class capacity, not a footnote to lithography.
- [Design & EDA](https://electronics-insider.com/pcb-design): Chip and board design and the tools behind it: EDA and verification, IP, chiplet and advanced-packaging design, PCB and substrate design, signal integrity, and the high-speed interconnect standards — UCIe, PCIe, HBM — that tie them together.
- [Trade & Policy](https://electronics-insider.com/supply-chain): The rules that move the chip supply chain: export controls and the entity list, tariffs on chips and chipmaking equipment, CHIPS-Act and Commerce actions, import bans and sanctions. One development per story, classified and dated.
- [The Silicon Brief](https://electronics-insider.com/brief): One edition every morning at 06:00 CET. The developments that moved the semiconductor and electronics industry overnight — fabs, nodes, memory, packaging, design tools, trade and policy — in a two-minute read. Written for people who work in chips and need to be current before their first meeting.

## Start here

- [Homepage](https://electronics-insider.com/)
- [All stories](https://electronics-insider.com/blog)
- [The Silicon Brief](https://electronics-insider.com/brief)
- [Our method and AI disclosure](https://electronics-insider.com/method)

## Recent

- [Signaloid founder Phillip Stanley-Marbell steps down from Cambridge chair to run probabilistic computing startup full-time](https://electronics-insider.com/blog/signaloid-stanley-marbell-cambridge-probabilistic-computing)
- [TSMC's COUPE co-packaged optics platform enters production in the second half of 2026](https://electronics-insider.com/blog/tsmc-coupe-cpo-production-2026)
- [Semiconductor Engineering frames energy efficiency as the defining constraint for AI computing through 2030](https://electronics-insider.com/blog/ai-energy-efficiency-semiconductor-imperative-2030)
- [IBM joins two cryogenic modules in a step toward a 1,000-qubit system by 2027](https://electronics-insider.com/blog/ibm-modular-cryogenic-modules-quantum-starling)
- [Engineering community survey finds nearly half expect quantum computing to remain more than five years from chip-design relevance](https://electronics-insider.com/blog/quantum-computing-chip-relevance-survey-results)
- [The Silicon Brief - 22 August 2026](https://electronics-insider.com/blog/silicon-brief-22-august-2026)
- [Agentrys claims its Studio platform lets chip design teams assemble a custom multi-agent flow in 30 minutes](https://electronics-insider.com/blog/agentrys-studio-multi-agent-chip-design-30-minutes)
- [Siemens EDA details Questa One's three-pillar AI update at DAC 2026](https://electronics-insider.com/blog/siemens-questa-one-dac-2026-update)
- [Lam Research's Semiverse Solutions shows feedforward control lifting wafer pass rates from 61% to 97% in digital twin simulation](https://electronics-insider.com/blog/feedforward-control-wafer-yield-semiverse-semulator3d)
- [Intel Foundry cuts carbon per wafer by up to 70% as AI demand pushes customers to scrutinise Scope 3](https://electronics-insider.com/blog/intel-foundry-scope-3-emissions-reduction)
- [India's fifth SEMICON India opens 17 September with Semicon 2.0 and three plants already in production](https://electronics-insider.com/blog/semicon-india-2026-semicon-20-september)
- [The Silicon Brief - 21 August 2026](https://electronics-insider.com/blog/silicon-brief-21-august-2026)
- [Quadric schedules three conference appearances to demonstrate Chimera GPNPU between 23 August and 24 September 2026](https://electronics-insider.com/blog/quadric-chimera-gpnpu-conference-tour-2026)
- [ESD Alliance schedules a Gen-AI for chip design and security webinar for 10 September 2026](https://electronics-insider.com/blog/esd-alliance-gen-ai-chip-security-webinar)
- [Nordson argues wafer-mapped sampling must replace static bond-test strategies as interconnects shrink to a few microns](https://electronics-insider.com/blog/nordson-wafer-mapped-bond-testing-advanced-packaging)