https://electronics-insider.com/blog/nvidia-vera-cpu-hot-chips-2026-agentic-ai Electronics Insider en 2026-09-09T04:25:17.708Z NVIDIA details Vera CPU's Olympus core architecture at Hot Chips 2026, claiming 1.8x agentic AI speedup 2026-09-09T04:25:17.708Z https://electronics-insider.com/blog/chipsmedia-wave6331x-fusa-asil-b-certification Electronics Insider en 2026-09-09T04:20:16.293Z Chips&Media's WAVE6331X FuSa video codec IP earns ISO 26262 ASIL-B certification from DNV 2026-09-09T04:20:16.293Z https://electronics-insider.com/blog/semi-chips-act-2-position-paper-europe Electronics Insider en 2026-09-09T04:20:14.642Z SEMI publishes nine-point position paper urging EU to widen Chips Act 2.0 beyond fabs 2026-09-09T04:20:14.642Z https://electronics-insider.com/blog/energy-vault-stoney-creek-bess-land-acquisition Electronics Insider en 2026-09-09T04:15:34.004Z Energy Vault completes land acquisition for its 125 MW / 1 GWh Stoney Creek BESS in New South Wales 2026-09-09T04:15:34.004Z https://electronics-insider.com/blog/humanoid-robot-compute-semiconductor-challenges-2026 Electronics Insider en 2026-09-09T04:15:32.735Z Humanoid robot shipments surged nearly 300% in H1 2026, but battery life and compute architecture remain the hard limits 2026-09-09T04:15:32.735Z https://electronics-insider.com/blog/silicon-brief-9-september-2026 Electronics Insider en 2026-09-09T04:05:13.721Z The Silicon Brief - 9 September 2026 2026-09-09T04:05:13.721Z https://electronics-insider.com/blog/semi-silicon-catalyst-global-mou-semiconductor-startups Electronics Insider en 2026-09-08T04:20:14.213Z SEMI and Silicon Catalyst sign global MOU to connect semiconductor startups with industry networks 2026-09-08T04:20:14.213Z https://electronics-insider.com/blog/ai-design-cycle-physical-realization-bottleneck Electronics Insider en 2026-09-08T04:20:13.431Z AI is compressing the design cycle - and exposing physical realization as the next bottleneck 2026-09-08T04:20:13.431Z https://electronics-insider.com/blog/tetramem-anaflash-dac-2026-compute-in-memory Electronics Insider en 2026-09-08T04:20:12.825Z Synopsys hosts TetraMem and ANAFLASH at DAC 2026 to show compute-in-memory chips attacking the AI weight-movement bottleneck 2026-09-08T04:20:12.825Z https://electronics-insider.com/blog/molex-minimix-hybrid-connector-humanoid-robots Electronics Insider en 2026-09-08T04:20:11.699Z Molex's MiniMix connector puts 15 A and 1 Gbps Ethernet into a 5.65 mm profile for humanoid robot joints 2026-09-08T04:20:11.699Z https://electronics-insider.com/blog/amphenol-h4-plus-p2kv-2000v-solar-connector Electronics Insider en 2026-09-08T04:15:07.484Z Amphenol extends its H4 solar connector platform to 2000 V DC with the new H4 Plus P2KV 2026-09-08T04:15:07.484Z https://electronics-insider.com/blog/semicon-west-2026-program-one-trillion Electronics Insider en 2026-09-07T11:44:58.809Z SEMI sets SEMICON West 2026 program around the industry's $1 trillion revenue milestone 2026-09-07T11:44:58.809Z https://electronics-insider.com/blog/delmic-sander-den-hoedt-ceo-interview Electronics Insider en 2026-09-07T11:44:09.328Z Delmic co-founder Sander den Hoedt built a TU Delft spinoff into a three-product electron microscopy company over 15 years 2026-09-07T11:44:09.328Z https://electronics-insider.com/blog/burkert-sidecontrol-digital-retrofit-pneumatic-valves Electronics Insider en 2026-09-07T11:35:41.825Z Bürkert extends SideCONTROL positioner range to add digital communications to existing pneumatic valves 2026-09-07T11:35:41.825Z https://electronics-insider.com/blog/binder-m12-midmount-pcb-connector-tubular-sensors Electronics Insider en 2026-09-07T11:35:11.815Z binder extends its M12 portfolio with an angled PCB connector designed for tubular sensor housings 2026-09-07T11:35:11.815Z https://electronics-insider.com/blog/yxy-ip68-cat6-coupler-outdoor-ethernet Electronics Insider en 2026-09-07T11:34:16.972Z YXY Electronics adds IP68 CAT6 coupler to its M20 connector line for permanent outdoor Ethernet runs 2026-09-07T11:34:16.972Z