https://electronics-insider.com/blog/agentrys-studio-multi-agent-chip-design-30-minutes Electronics Insider en 2026-08-21T04:20:15.504Z Agentrys claims its Studio platform lets chip design teams assemble a custom multi-agent flow in 30 minutes 2026-08-21T04:20:15.504Z https://electronics-insider.com/blog/siemens-questa-one-dac-2026-update Electronics Insider en 2026-08-21T04:20:14.290Z Siemens EDA details Questa One's three-pillar AI update at DAC 2026 2026-08-21T04:20:14.290Z https://electronics-insider.com/blog/feedforward-control-wafer-yield-semiverse-semulator3d Electronics Insider en 2026-08-21T04:15:18.040Z Lam Research's Semiverse Solutions shows feedforward control lifting wafer pass rates from 61% to 97% in digital twin simulation 2026-08-21T04:15:18.040Z https://electronics-insider.com/blog/intel-foundry-scope-3-emissions-reduction Electronics Insider en 2026-08-21T04:15:17.325Z Intel Foundry cuts carbon per wafer by up to 70% as AI demand pushes customers to scrutinise Scope 3 2026-08-21T04:15:17.325Z https://electronics-insider.com/blog/semicon-india-2026-semicon-20-september Electronics Insider en 2026-08-21T04:15:15.581Z India's fifth SEMICON India opens 17 September with Semicon 2.0 and three plants already in production 2026-08-21T04:15:15.581Z https://electronics-insider.com/blog/silicon-brief-21-august-2026 Electronics Insider en 2026-08-21T04:05:16.222Z The Silicon Brief - 21 August 2026 2026-08-21T04:05:16.222Z https://electronics-insider.com/blog/quadric-chimera-gpnpu-conference-tour-2026 Electronics Insider en 2026-08-20T04:20:13.512Z Quadric schedules three conference appearances to demonstrate Chimera GPNPU between 23 August and 24 September 2026 2026-08-20T04:20:13.512Z https://electronics-insider.com/blog/esd-alliance-gen-ai-chip-security-webinar Electronics Insider en 2026-08-20T04:20:11.712Z ESD Alliance schedules a Gen-AI for chip design and security webinar for 10 September 2026 2026-08-20T04:20:11.712Z https://electronics-insider.com/blog/nordson-wafer-mapped-bond-testing-advanced-packaging Electronics Insider en 2026-08-20T04:15:12.419Z Nordson argues wafer-mapped sampling must replace static bond-test strategies as interconnects shrink to a few microns 2026-08-20T04:15:12.419Z https://electronics-insider.com/blog/nvidia-800vdc-ai-data-center-power-architecture Electronics Insider en 2026-08-20T04:15:11.759Z NVIDIA, Google, and Microsoft push 800 VDC into AI data centers through OCP, targeting 2 MW per rack row by 2027 2026-08-20T04:15:11.759Z https://electronics-insider.com/blog/ai-inference-heterogeneous-chips-disaggregation Electronics Insider en 2026-08-20T04:15:10.996Z AI data centers are splitting inference across CPUs, GPUs, and RDUs to cut token cost 2026-08-20T04:15:10.996Z https://electronics-insider.com/blog/silicon-brief-20-august-2026 Electronics Insider en 2026-08-20T04:05:13.621Z The Silicon Brief - 20 August 2026 2026-08-20T04:05:13.621Z