Binghamton team cuts papertronic feature size to 250 µm by switching to parchment paper and a CO₂ laser
Researchers at Binghamton University replaced wax-patterned chromatography paper with laser-written parchment paper, shrinking passive circuit features to 250 µm and cutting device footprint by more than 200%.

A research team at Binghamton University's Bioelectronics and Microsystems Laboratory has demonstrated passive electronic components - resistors, capacitors, interconnects, and complete RC filters - on commercial parchment paper, achieving feature widths of 250 µm with 300 µm spacing and a device footprint reduction of more than 200% compared with wax-based methods[1]. The paper, "High-Density Papertronics via Laser-Written Hydrophilicity on Hydrophobic Parchment Paper," was published in ACS Applied Materials & Interfaces in April 2026.
The problem with wax
Earlier work by the same group, led by Professor Seokheun "Sean" Choi of the Department of Electrical and Computer Engineering, used chromatography paper as the substrate. Wax barriers defined the circuit features, but molten wax spread during thermal processing, blurring boundaries and limiting the smallest achievable features to roughly 1 mm[1]. That constraint kept complete circuits on the scale of tens of centimeters - too large for the compact, single-use medical patches and sensor tags the team is targeting.
Inverting the fabrication paradigm
The new approach flips the logic entirely. Instead of starting with a hydrophilic substrate and printing hydrophobic wax barriers, the team starts with hydrophobic parchment paper - the silicone-coated baking paper sold in any supermarket - and uses a standard carbon dioxide laser to write hydrophilic channels directly into it[1]. Wherever the laser removes the silicone coating, the underlying cellulose becomes receptive to water-based conductive inks; everywhere else, the intact coating acts as a natural insulator. No wax, no masks, and no high-temperature processing are required.
The laser-defined channels exhibit no lateral spreading, which is the key resolution advantage over the wax approach[1].
What the platform can do
The team demonstrated a full set of passive components on a single sheet of paper:
- Resistors tunable over three orders of magnitude by adjusting ink formulation
- Interconnects with sheet resistance as low as approximately 1 Ω/sq, comparable to rigid systems
- Capacitors tunable from microfarads to millifarads
- Fully functional low-pass and high-pass RC filters whose measured frequency response matches theoretical predictions
All functional inks are water-based and free of toxic metals or organic solvents. The circuits are biodegradable, breaking down in soil within weeks, and can be incinerated to ash in seconds when rapid disposal is needed. A thin silicone encapsulation layer is available for applications that need longer operational lifetimes without affecting electrical performance.
Remaining barriers
The authors are candid about what still needs work. Resolution is currently bounded by the optical system of the CO₂ laser, and the team notes that finer patterning is achievable through optical refinement. Commercialization also requires demonstrating consistent electrical performance across manufacturing-scale runs of parchment paper, which varies more than laboratory-grade chromatography paper. The target applications - single-use medical patches powered by sweat or saliva, and biodegradable supply-chain sensor tags - remain at the research stage.
Whether the substrate switch translates into a manufacturable process is the question to watch. The resolution numbers are credible, but the gap between a lab demonstration and a roll-to-roll production line for disposable electronics is wide, and no commercial partner has been announced.
Written by Electronics Insider's automated desk from the sources above and published automatically. How we work.
Related
Design & EDAiQ Sense describes a battery-less, RFID-scale photonic implant for continuous biochemical monitoring in animals
iQ Sense CEO Brendan Emery explains how a photonic integrated circuit, wireless power, and on-device AI are co-packaged into a battery-less implant for real-time biomarker monitoring in animals.
11 Aug 2026
Design & EDASemiWiki publishes CEO interview with David Reeder, who took the helm at Entegris in August 2025
SemiWiki's CEO interview with Entegris president David Reeder covers his background, strategic priorities, and how AI-driven node transitions are reshaping demand for advanced semiconductor materials.
11 Aug 2026
SemiconductorsEuropean Commission and SpaceRISE sign IRIS² implementation agreement, expanding constellation to 348 satellites
On 7 August 2026, the EU and SpaceRISE signed the IRIS² implementation agreement, adding 66 satellites to reach 348 spacecraft and boosting secure governmental capacity by 60%.
11 Aug 2026