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SemiWiki publishes CEO interview with David Reeder, who took the helm at Entegris in August 2025

SemiWiki's CEO interview with Entegris president David Reeder covers his background, strategic priorities, and how AI-driven node transitions are reshaping demand for advanced semiconductor materials.

11 Aug 2026Generated imageDesign & EDA

Imperial College London and University of Exeter map saturation limits in ultrafast ITO optical switching with a 44 fs pump pulse

Researchers from Imperial College London and the University of Exeter have published a combined experimental and theoretical study of ultrafast optical switching in ITO thin films, identifying the saturation regime and Auger transitions that limit modulator performance.

10 Aug 2026Generated imageDesign & EDA

TSMC's CoWoS-S silicon interposer reaches ~2500 mm² in its fifth generation to meet AI accelerator bandwidth demands

TSMC's fifth-generation CoWoS-S uses a mask-stitched silicon interposer at ~2500 mm² to co-integrate logic dies and HBM stacks for AI accelerators - and the roadmap goes further still.

10 Aug 2026Generated imageDesign & EDA

Imec publishes lubrication-elasticity model for predicting bond front velocity in wafer and die bonding

Imec researcher Utkarsh Jain published a lubrication-elasticity model in May 2026 that derives a self-consistent formulation for bond front velocity in flexible-substrate bonding, targeting process control in 3D IC packaging.

9 Aug 2026Generated imageDesign & EDA

SIA and Deloitte find semiconductors account for 95% of an AI server rack's value in June 2026 teardown study

A June 2026 SIA-Deloitte virtual teardown of a state-of-the-art AI server rack finds chips make up over 95% of its content value and projects $1.2 trillion in annual semiconductor revenue from AI data centers by 2028.

8 Aug 2026Generated imageDesign & EDA

MIT-led team uses ultrafast X-ray diffraction to map heat flow in GaN-on-silicon thin films

Researchers from MIT, SLAC, Stanford, and Argonne published a non-contact X-ray method that maps in-plane thermal conductivity and interfacial conductance in GaN thin films, revealing a fourfold conductivity drop near a single wrinkle defect.

8 Aug 2026Generated imageDesign & EDA

Binghamton team cuts papertronic feature size to 250 µm by switching to parchment paper and a CO₂ laser

Researchers at Binghamton University replaced wax-patterned chromatography paper with laser-written parchment paper, shrinking passive circuit features to 250 µm and cutting device footprint by more than 200%.

7 Aug 2026Generated imageDesign & EDA

Actions Technology and Ceva launch ATS296X audio SoCs with Bluetooth HDT and dual-RF on 4 August 2026

Actions Technology and Ceva announced the ATS296X-series on 4 August 2026 - among the earliest commercial Bluetooth HDT chips, raising peak throughput from 2 Mbps to ~7.5 Mbps.

7 Aug 2026Generated imageDesign & EDA

HiRain's LRR615 brings China's first high-density waveguide antenna to 4D imaging radar

HiRain Technologies launched the LRR615 on 24 April 2025, a production-intent 4D imaging radar built on Arbe's chipset and China's first high-density waveguide antenna design.

6 Aug 2026Generated imageDesign & EDA

VIAVI launches a 22 × 42 mm GNSS-disciplined oscillator claiming microsecond-class 24-hour holdover

VIAVI's µPNT GDO-1000 fits in an M.2 B-key footprint, weighs under 4 g, and claims microsecond-class 24-hour holdover using a MEMS oscillator and patented AI/ML algorithms.

6 Aug 2026

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