ELECTRONICS·INSIDER
All stories

Latest

All stories →
Generated imageDesign & EDA

FlowAccel's Joel Jorgensen argues chip teams must design their workflows before AI can help them hit tape-out

Joel Jorgensen of FlowAccel argues that AI tools alone won't save a tape-out schedule - teams must first design the cross-team workflows that let those tools compound into real gains.

15 Oct 2026Generated imageSemiconductors

ETH Zürich and NYU find JEDEC test loops underestimate HBM2 power by up to 35.4%

Researchers at ETH Zürich and NYU tested 36 real HBM2 chips and found JEDEC-specified current loops can underestimate peak power by up to 35.4%, with implications for AI accelerator thermal design.

15 Oct 2026Generated imageSemiconductors

Sandia and Luxembourg researchers map the exact leakage route in gate-all-around transistors

Researchers at Sandia and Luxembourg's LIST used quantum-transport simulations to spatially resolve gate-drain tunneling in GAAFETs, pinpointing where leakage current flows at the device level.

15 Oct 2026Generated imageSemiconductors

Fortastra raises $30 million in Series A to build autonomous orbital security spacecraft

Torrance-based startup Fortastra has closed a $30 million Series A to develop maneuverable, autonomous spacecraft for on-orbit satellite protection, days after its first pair reached orbit.

15 Oct 2026Generated imageDesign & EDA

Eric Hong outlines Mixel's mixed-signal IP strategy after Silvaco acquisition

Mixel VP of Engineering Eric Hong discusses the company's PHY and SerDes roadmap, its TSMC N2P debut, and how the Silvaco acquisition is reshaping its IP strategy.

14 Oct 2026Generated imageDesign & EDA

VSORA chair Sandra Rivera tells Bloomberg that AI inference demand is durable but consolidation is coming

VSORA chair Sandra Rivera appeared on Bloomberg's The Close on 24 July 2026, arguing that AI inference demand is real and durable - but that not every chip startup will survive the shakeout.

14 Oct 2026Generated imageSemiconductors

Applied Materials opens its $5 billion EPIC Center in Sunnyvale on 12 October

Applied Materials unveiled its $5 billion EPIC Center in Sunnyvale on 12 October 2026 - the world's largest facility for collaborative semiconductor equipment R&D, with TSMC, Intel, Samsung, Micron and SK hynix as founding partners.

14 Oct 2026Generated imageSemiconductors

HARTING's Han HC DCT contacts carry up to 20% more current through a dual-path design

HARTING's new Han HC DoubleContact Technology contacts route current through two parallel paths, delivering up to 20% higher capacity with improved safety and easier installation.

14 Oct 2026Generated imageSemiconductors

University researchers propose on-chip monitors to catch bit-flip attacks in AI accelerators at runtime

Researchers from UF, UT Dallas, and RPI published BARE-AI on 6 October 2026 - a runtime framework that detects and repairs bit-flip attacks in AI accelerators with under 4% area overhead at 28 nm.

14 Oct 2026Generated imageDesign & EDA

Onto Innovation extends FAaST platform to map residual surface charge across wafers and panels in advanced packaging

Onto Innovation published details on 8 October 2026 of how its FAaST non-contact electrical metrology platform addresses residual charge buildup in advanced packaging flows.

13 Oct 2026Generated imageDesign & EDA

CPO test equipment is chasing a device target that keeps moving

Test vendors are building CPO production tooling while connector standards, laser sources, and optical-engine designs are still in flux - a structural mismatch the industry has not yet resolved.

13 Oct 2026Generated imageSemiconductors

Galileo wins permits for two 125 MW battery storage projects in Italy, totalling 1.5 GWh

Zurich-based developer Galileo has secured planning consent for 250 MW / 1.5 GWh of battery storage in Italy, with a further ~100 MW expected in the coming weeks.

13 Oct 2026