Signaloid founder Phillip Stanley-Marbell steps down from Cambridge chair to run probabilistic computing startup full-time

TSMC's COUPE co-packaged optics platform enters production in the second half of 2026

TSMC's Compact Universal Photonic Engine moves from qualification to volume production in H2 2026, promising 2x power efficiency and 10x lower latency over pluggable optics.

Semiconductor Engineering frames energy efficiency as the defining constraint for AI computing through 2030

Data center electricity is set to nearly double to 945 TWh by 2030, making energy efficiency the central strategic challenge - and opportunity - for every company deploying AI at scale.

IBM joins two cryogenic modules in a step toward a 1,000-qubit system by 2027

IBM connected and cooled two modular cryogenic systems on 19 August 2026, reaching below 15 millikelvin - a hardware milestone on its path to the Quantum Starling system in 2029.

Engineering community survey finds nearly half expect quantum computing to remain more than five years from chip-design relevance

A community survey on quantum computing finds roughly 45% of engineers believe the technology is still more than five years from affecting their chip work, while curiosity about it runs high.

Agentrys claims its Studio platform lets chip design teams assemble a custom multi-agent flow in 30 minutes

Agentrys says its Studio platform can stand up a custom multi-agent chip design flow in about 30 minutes, with a live demonstration planned for Hot Chips 2026 on 23-25 August.

Siemens EDA details Questa One's three-pillar AI update at DAC 2026

Siemens EDA briefed attendees at DAC 2026 on Questa One's latest AI-driven verification updates, covering faster engines, MCP-enabled inter-engine communication, and an Agentic Toolkit with five domain-scoped agents.

Lam Research's Semiverse Solutions shows feedforward control lifting wafer pass rates from 61% to 97% in digital twin simulation

Lam Research's Semiverse Solutions used SEMulator3D digital twin simulation to show feedforward etch control raising wafer pass rates from 60.82% to 96.77% and improving Cpk 2.5x.

Intel Foundry cuts carbon per wafer by up to 70% as AI demand pushes customers to scrutinise Scope 3

Intel's 2025-26 Corporate Responsibility Report shows a 70% carbon-per-wafer reduction and $999 million in green investment, directly lowering Scope 3 emissions for foundry customers.

India's fifth SEMICON India opens 17 September with Semicon 2.0 and three plants already in production

SEMICON India 2026 runs 17-19 September in New Delhi with 500+ exhibitors and a new six-pillar Semicon 2.0 programme, as three Sanand facilities reach commercial production.

Quadric schedules three conference appearances to demonstrate Chimera GPNPU between 23 August and 24 September 2026

Quadric will appear at HotChips, AI Infra Summit, and Embedded World North America between 23 August and 24 September 2026 to demonstrate its Chimera GPNPU processor IP.

20 Aug 2026

ESD Alliance schedules a Gen-AI for chip design and security webinar for 10 September 2026

The ESD Alliance's Savage on Security series returns on 10 September 2026, examining how multi-agent LLM systems will automate SoC design and security verification.

20 Aug 2026