Today's digest: Broadcom eyes $60B in debt for an AI chip deal, Micron commits $10B to a Boise research lab, Wolfspeed's AI data center revenue more than doubles, Arista hits 12.8 Tb/s at Hot Interconnects, Kulicke & Soffa names a new CEO, and Washington directs federal agencies to prioritise semiconductor R&D.
22 Aug 2026
The Silicon BriefToday's digest: TSMC confirms A16 mass production for Q4 2026, SIA names a new CEO, Samsung details SF2Z backside power for 2027, bond reliability emerges as a critical test bottleneck, and TSMC's Arizona second fab moves to equipment installation.
21 Aug 2026
The Silicon BriefToday's digest: Samsung locks its 1.4 nm node to 2029, Intel closes a $20 billion equity raise, NVIDIA turns compute into a Wall Street asset class, Micron opens a $250 million AI venture fund, and bond reliability emerges as the critical vulnerability in high-density semiconductor test.
20 Aug 2026
The Silicon BriefToday's digest: Intel and ASML confirm High-NA EUV in volume production as TSMC and Samsung defer to 2030, SK Hynix locks in a $500B Nvidia partnership, Nokia acquires NXP's Chandler fab for InP, Aixtron's optoelectronics orders surge 81%, and bond integrity emerges as the hidden reliability bottleneck in high-density test.
18 Aug 2026
The Silicon BriefToday's digest: SMIC and Hua Hong hit record utilisation, Samsung repurposes its Giheung R&D line for 2 nm HBM base dies, TSMC confirms three straight years of CoWoS capacity doubling, Samsung defers High-NA EUV to 1 nm, and competition shifts from silicon to systems.
17 Aug 2026
The Silicon BriefToday's digest: Lam Research commits $3 B to R&D lab expansion, Michigan and Imec launch Common Earth to cut rare-earth dependence, AI chiplet test complexity deepens, CPO test standardization stalls, and the industry reframes competition around systems rather than silicon.
16 Aug 2026
The Silicon BriefToday's digest: Samsung shifts legacy DRAM backend to Vietnam for HBM headroom, SK Hynix scouts US fab sites, Silicon Motion closes a $1.15 B bond, WSTS lifts its full-year forecast to $1.65 T, and the CHIPS Act R&D portfolio gets redirected.
15 Aug 2026
The Silicon BriefToday's digest: Nvidia ships CPO switches but testing standards lag, Samsung and SK Hynix signal rival HBM strategies ahead of Hot Chips, AI chiplet test complexity deepens, and measurement validity in multi-die packages.
14 Aug 2026
The Silicon BriefToday's digest: Qualcomm raises chip prices from 1 September, Apple and Micron clash at the White House over Chinese memory, Samsung doubles 2nm foundry wins, HBM4 pricing signals a possible AI demand plateau, and Nvidia's Vera Rubin ramp tightens the HBM supply chain.
13 Aug 2026
The Silicon BriefToday's digest: SIA confirms a record Q2 at $403.3 B, Japan's WF₆ shutdown bites, TSMC's 1.4 nm Taichung fab runs ahead of schedule, TSMC develops an EMIB-like packaging rival, and HBM testing emerges as a 3D yield bottleneck.
12 Aug 2026
The Silicon BriefToday's digest: TSMC's July revenue hits $14.5 B on AI demand, Sony and TSMC commit $6.32 B to a Kumamoto image sensor JV, South Korea launches a $3.52 B chip ecosystem fund, Apple tests CXMT memory amid a DRAM squeeze, and imec advances III-V chiplet integration on its 300 mm RF interposer.
11 Aug 2026
The Silicon BriefToday's digest: AMD acquires Taalas for model-etched inference silicon, Samsung unveils zHBM at FMS 2026, SK Hynix and SanDisk publish the first HBF standard, TSMC lifts its capex ceiling, and Intel commits €5 billion to its Irish EUV campus.
8 Aug 2026
The Silicon BriefToday's digest: SK Hynix's record $26.5 B Nasdaq debut and $713 B domestic expansion, the SIA's all-time monthly sales record, EU Chips Act 2.0, chip hardware security, 3D IC packaging, and autonomous EDA agents.
7 Aug 2026