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IBM joins two cryogenic modules in a step toward a 1,000-qubit system by 2027

IBM connected and cooled two modular cryogenic systems on 19 August 2026, reaching below 15 millikelvin - a hardware milestone on its path to the Quantum Starling system in 2029.

22 Aug 2026Generated imageSemiconductors

Engineering community survey finds nearly half expect quantum computing to remain more than five years from chip-design relevance

A community survey on quantum computing finds roughly 45% of engineers believe the technology is still more than five years from affecting their chip work, while curiosity about it runs high.

22 Aug 2026Generated imageSemiconductors

Lam Research's Semiverse Solutions shows feedforward control lifting wafer pass rates from 61% to 97% in digital twin simulation

Lam Research's Semiverse Solutions used SEMulator3D digital twin simulation to show feedforward etch control raising wafer pass rates from 60.82% to 96.77% and improving Cpk 2.5x.

21 Aug 2026Generated imageSemiconductors

Intel Foundry cuts carbon per wafer by up to 70% as AI demand pushes customers to scrutinise Scope 3

Intel's 2025-26 Corporate Responsibility Report shows a 70% carbon-per-wafer reduction and $999 million in green investment, directly lowering Scope 3 emissions for foundry customers.

21 Aug 2026Generated imageSemiconductors

India's fifth SEMICON India opens 17 September with Semicon 2.0 and three plants already in production

SEMICON India 2026 runs 17-19 September in New Delhi with 500+ exhibitors and a new six-pillar Semicon 2.0 programme, as three Sanand facilities reach commercial production.

21 Aug 2026Generated imageSemiconductors

Nordson argues wafer-mapped sampling must replace static bond-test strategies as interconnects shrink to a few microns

Nordson's Semiconductor Engineering analysis shows why static bond-test sampling is failing advanced packaging, and how dynamic wafer mapping is taking its place.

20 Aug 2026Generated imageSemiconductors

NVIDIA, Google, and Microsoft push 800 VDC into AI data centers through OCP, targeting 2 MW per rack row by 2027

NVIDIA, Google, and Microsoft are formalising 800 VDC as the power standard for megawatt-scale AI racks, with more than 80 ecosystem companies already building to the OCP specification.

20 Aug 2026Generated imageSemiconductors

AI data centers are splitting inference across CPUs, GPUs, and RDUs to cut token cost

A Semiconductor Engineering roundtable finds that heterogeneous clusters - not faster GPUs alone - are the primary lever for reducing AI inference token cost in 2026.

20 Aug 2026Generated imageSemiconductors

Coherent ships 300 mm SiC substrate samples to AI semiconductor partners

Coherent began sampling 300 mm high-thermal-conductivity SiC substrates to AI chip customers on 17 August 2026, targeting a 25% heat-spreading improvement over current solutions.

19 Aug 2026Generated imageSemiconductors

NVIDIA backs OpenAI's 8 IT-GW Ohio AI campus with a $105 billion guarantee and $1.5 billion equity stake

NVIDIA secured land, power and shell capacity at SB Energy's PORTS-Pike campus in Ohio for OpenAI, disclosing a $105 billion guarantee and a $1.5 billion equity investment on 17 August 2026.

19 Aug 2026Generated imageSemiconductors

Nordson details how bond testing is shifting from sampling to data-driven process control in advanced packaging

Nordson's Semiconductor Engineering analysis shows bond testing moving beyond spot-checks toward AI-driven, wafer-mapped sampling as interconnect dimensions shrink to a few microns.

19 Aug 2026Generated imageSemiconductors

Securus Monitoring brings GPS and remote alcohol testing to APPA's annual training institute in Chicago

Securus Monitoring is demonstrating BLUtag GPS and SoberTrack alcohol-testing devices at the APPA Annual Training Institute in Chicago, 16-19 August 2026, citing a 30% reduction in supervision failure.

18 Aug 2026

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