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Every story we have published, newest first, across all three beats.

Generated imageDesign & EDA

iQ Sense describes a battery-less, RFID-scale photonic implant for continuous biochemical monitoring in animals

iQ Sense CEO Brendan Emery explains how a photonic integrated circuit, wireless power, and on-device AI are co-packaged into a battery-less implant for real-time biomarker monitoring in animals.

11 Aug 2026Generated imageDesign & EDA

SemiWiki publishes CEO interview with David Reeder, who took the helm at Entegris in August 2025

SemiWiki's CEO interview with Entegris president David Reeder covers his background, strategic priorities, and how AI-driven node transitions are reshaping demand for advanced semiconductor materials.

11 Aug 2026Generated imageSemiconductors

European Commission and SpaceRISE sign IRIS² implementation agreement, expanding constellation to 348 satellites

On 7 August 2026, the EU and SpaceRISE signed the IRIS² implementation agreement, adding 66 satellites to reach 348 spacecraft and boosting secure governmental capacity by 60%.

11 Aug 2026Generated imageSemiconductors

Brewer Science closes Heraeus Epurio chemicals deal on 3 August 2026, adding a Dayton, Ohio production site

Brewer Science completed its acquisition of Heraeus Epurio's semiconductor chemicals business on 3 August 2026, bringing ultrapure chemical manufacturing in-house at a Dayton, Ohio facility.

11 Aug 2026Generated imageThe Silicon Brief

The Silicon Brief - 11 August 2026

Today's digest: TSMC's July revenue hits $14.5 B on AI demand, Sony and TSMC commit $6.32 B to a Kumamoto image sensor JV, South Korea launches a $3.52 B chip ecosystem fund, Apple tests CXMT memory amid a DRAM squeeze, and imec advances III-V chiplet integration on its 300 mm RF interposer.

11 Aug 2026Generated imageDesign & EDA

Imperial College London and University of Exeter map saturation limits in ultrafast ITO optical switching with a 44 fs pump pulse

Researchers from Imperial College London and the University of Exeter have published a combined experimental and theoretical study of ultrafast optical switching in ITO thin films, identifying the saturation regime and Auger transitions that limit modulator performance.

10 Aug 2026Generated imageDesign & EDA

TSMC's CoWoS-S silicon interposer reaches ~2500 mm² in its fifth generation to meet AI accelerator bandwidth demands

TSMC's fifth-generation CoWoS-S uses a mask-stitched silicon interposer at ~2500 mm² to co-integrate logic dies and HBM stacks for AI accelerators - and the roadmap goes further still.

10 Aug 2026Generated imageDesign & EDA

Imec publishes lubrication-elasticity model for predicting bond front velocity in wafer and die bonding

Imec researcher Utkarsh Jain published a lubrication-elasticity model in May 2026 that derives a self-consistent formulation for bond front velocity in flexible-substrate bonding, targeting process control in 3D IC packaging.

9 Aug 2026Generated imageSemiconductors

ZEISS launches Crossbeam 750 FIB-SEM with continuous SEM imaging during milling for leading-edge failure analysis

ZEISS unveiled the Crossbeam 750 FIB-SEM on 31 March 2026, combining Gemini 4 optics with HDR Mill + SEM to deliver uninterrupted, real-time imaging during low-kV FIB finishing for advanced-node TEM lamella prep.

9 Aug 2026Generated imageSemiconductors

Wiley publishes a practical guide to phase noise and its effects on RF system performance

A new Wiley whitepaper explains how oscillator phase noise degrades RF systems through spectral regrowth, reciprocal mixing, and constellation rotation - and how to measure it accurately.

9 Aug 2026Generated imageSemiconductors

GlobalPlatform launches Pavona, the first open-silicon distribution with production-grade post-quantum cryptography, on 26 May 2026

GlobalPlatform launched Pavona on 26 May 2026 - an open-source silicon distribution with 12 founding members, two TSMC 3 nm taped-out root-of-trust designs, and the first openly available PQC stack for embedded silicon.

9 Aug 2026Generated imageDesign & EDA

SIA and Deloitte find semiconductors account for 95% of an AI server rack's value in June 2026 teardown study

A June 2026 SIA-Deloitte virtual teardown of a state-of-the-art AI server rack finds chips make up over 95% of its content value and projects $1.2 trillion in annual semiconductor revenue from AI data centers by 2028.

8 Aug 2026Generated imageDesign & EDA

MIT-led team uses ultrafast X-ray diffraction to map heat flow in GaN-on-silicon thin films

Researchers from MIT, SLAC, Stanford, and Argonne published a non-contact X-ray method that maps in-plane thermal conductivity and interfacial conductance in GaN thin films, revealing a fourfold conductivity drop near a single wrinkle defect.

8 Aug 2026Generated imageSemiconductors

Cities are wasting LEDs' ability to cut light pollution, with night-sky brightness rising 9.6% per year

LEDs promised darker, healthier nights. Instead, a rebound effect is pushing sky brightness up 9.6% annually. Here's why the technology is being squandered.

8 Aug 2026
Semiconductors
Semiconductors

ENISA brings its CVE Root network to 20 CNAs with the addition of NATO's NCIA and AI firm AISLE

ENISA has expanded its CVE Root network to 20 CNAs, adding NATO's NCIA and AI cybersecurity firm AISLE - a milestone in Europe's push to diversify global vulnerability management.

8 Aug 2026Generated imageSemiconductors

Georgia Tech and Seoul National University publish a Band-Aid-sized forehead patch that tracks glymphatic brain-water dynamics during home sleep

Researchers at Georgia Tech and Seoul National University have published a soft, wireless near-infrared patch that monitors brain-water shifts tied to the glymphatic system during natural home sleep.

8 Aug 2026Generated imageThe Silicon Brief

The Silicon Brief - 8 August 2026

Today's digest: AMD acquires Taalas for model-etched inference silicon, Samsung unveils zHBM at FMS 2026, SK Hynix and SanDisk publish the first HBF standard, TSMC lifts its capex ceiling, and Intel commits €5 billion to its Irish EUV campus.

8 Aug 2026Generated imageDesign & EDA

Binghamton team cuts papertronic feature size to 250 µm by switching to parchment paper and a CO₂ laser

Researchers at Binghamton University replaced wax-patterned chromatography paper with laser-written parchment paper, shrinking passive circuit features to 250 µm and cutting device footprint by more than 200%.

7 Aug 2026Generated imageDesign & EDA

Actions Technology and Ceva launch ATS296X audio SoCs with Bluetooth HDT and dual-RF on 4 August 2026

Actions Technology and Ceva announced the ATS296X-series on 4 August 2026 - among the earliest commercial Bluetooth HDT chips, raising peak throughput from 2 Mbps to ~7.5 Mbps.

7 Aug 2026Generated imageSemiconductors

BadCredit.org survey finds 79% of prediction-market users are losing money, half betting with borrowed funds

A BadCredit.org survey of 1,000 U.S. adults finds 79% of prediction-market users are losing money, and 51% are betting with borrowed funds - with losses hitting 88% among those who borrow.

7 Aug 2026Generated imageSemiconductors

Cerebras Systems stock falls 47% from its 14 May 2026 IPO-day high as margin concerns override revenue growth

Cerebras Systems soared 68% on its Nasdaq debut on 14 May 2026, then lost nearly half its peak value within six weeks as investors punished a shrinking gross-margin outlook.

7 Aug 2026Generated imageThe Silicon Brief

The Silicon Brief - 7 August 2026

Today's digest: SK Hynix's record $26.5 B Nasdaq debut and $713 B domestic expansion, the SIA's all-time monthly sales record, EU Chips Act 2.0, chip hardware security, 3D IC packaging, and autonomous EDA agents.

7 Aug 2026Generated imageDesign & EDA

HiRain's LRR615 brings China's first high-density waveguide antenna to 4D imaging radar

HiRain Technologies launched the LRR615 on 24 April 2025, a production-intent 4D imaging radar built on Arbe's chipset and China's first high-density waveguide antenna design.

6 Aug 2026Generated imageDesign & EDA

VIAVI launches a 22 × 42 mm GNSS-disciplined oscillator claiming microsecond-class 24-hour holdover

VIAVI's µPNT GDO-1000 fits in an M.2 B-key footprint, weighs under 4 g, and claims microsecond-class 24-hour holdover using a MEMS oscillator and patented AI/ML algorithms.

6 Aug 2026Generated imageSemiconductors

JAXA's Hayabusa2 completes the world's first laser ranging during an asteroid flyby on 5 July 2026

JAXA's Hayabusa2 used its onboard LIDAR to achieve the world's first successful laser ranging during an asteroid flyby, firing pulses at Torifune from 20 km at 5 km/s on 5 July 2026.

6 Aug 2026Generated imageSemiconductors

Vishay launches TSOP15300 IR receiver series with a 30 kHz to 68 kHz modulation range

Vishay's TSOP15300 series IR receiver modules cover 30 kHz to 68 kHz in a single 4-pin Heimdall package, targeting universal remote control designs in consumer electronics.

6 Aug 2026Generated imageSemiconductors

Statista survey puts satellite internet home use at 4% in Germany, lower still in Japan and China

A Statista Consumer Insights survey finds satellite internet used in just 4% of German homes, with similarly low figures in Japan and even lower in China - despite Starlink's global growth.

6 Aug 2026Generated imageThe Silicon Brief

The Silicon Brief - 6 August 2026

Today's digest: the semiconductor market's extraordinary 2026 growth forecast, AMD's MI455X multi-die GPU, Synopsys's role in enabling it, chiplet simulation bottlenecks, and AI-augmented fab analytics.

6 Aug 2026