Frore Systems adds diamond wafers to its LiquidJet coldplate, claiming a 22 °C GPU temperature drop

Frore Systems announced LiquidJet Diamond on 8 October 2026, a direct-to-chip liquid-cooling coldplate that embeds diamond wafers above GPU hotspots to handle the extreme heat densities produced by next-generation AI accelerators^[1]. The headline claim: a temperature reduction of up to 22 °C versus conventional coldplates, and a hotspot power density rating of 770 W/cm²^[1].

How the diamond spreader works

LiquidJet Diamond builds on Frore's existing LiquidJet architecture, which routes coolant through three-dimensional, ultra-short channels arranged in multiple stages^[1]. Rather than distributing coolant uniformly, the design targets the highest-heat regions of the die first, then moves on to the rest of the GPU, high-bandwidth memory, and surrounding components^[1].

The new element is a heat spreader that places diamond wafers on the bottom surface of the coldplate, directly above processor hotspots^[1]. Diamond's thermal conductivity can exceed 20 W/cm·K - roughly five times that of copper at approximately 4 W/cm·K - so heat spreads laterally before it reaches the liquid-cooling channels above, reducing the peak temperature the coolant must absorb.

Frore's published specifications describe the following operating conditions:

• Hotspot area: 5 mm × 5 mm
• Hotspot power density: 770 W/cm²
• Coolant inlet temperature: 25 °C
• Maximum junction temperature: 95 °C
• Thermal interface material: PTM7950, on an unlidded processor^[1]

The company's earlier LiquidJet was rated for hotspots of approximately 600 W/cm²^[1]. Frore says the diamond version delivers 75% higher heat-transfer efficiency and more than 150% greater maximum hotspot power density than conventional skived coldplates^[1].

Claimed efficiency gains

Frore breaks the temperature improvement into two stages. The baseline LiquidJet coldplate is said to lower GPU die temperature by 12 °C relative to a conventional coldplate, translating to a 25% improvement in AI tokens per watt^[1]. Adding the diamond spreader contributes a further 10 °C reduction at hotspot locations, pushing the tokens-per-watt gain to 30-35%^[1].

These figures come from Frore's own thermal and performance models, not independently published benchmarks^[1]. Actual results will vary with processor packaging, coolant temperature, thermal interface quality, and operating conditions. Frore has not disclosed details of its diamond wafer manufacturing or integration process^[1].

The technology is aimed at high-power processors including Nvidia's Rubin family - rated at 2,300 W - and AMD's Instinct accelerators^[1].

OCP Global Summit demonstrations

Frore is demonstrating both LiquidJet and LiquidJet Diamond at the OCP Global Summit, held at the San Jose McEnery Convention Center from 12 to 16 October 2026^[1]. The LiquidJet demo targets the 2,300 W Nvidia Rubin processor; the LiquidJet Diamond demo focuses on the 770 W/cm² hotspot condition^[1]. Frore is also showing LiquidJet Nexus, an integrated coldplate assembly designed for half-U compute trays^[1].

The company, which raised $143 million in a Series D round at a $1.64 billion valuation earlier this year, has now raised $340 million in total. Independent validation of the LiquidJet Diamond performance claims - and disclosure of the diamond integration process - will be the key milestones to watch before the product reaches production deployments.